Lead Frame

 The lead frame, which serves as the chip carrier for integrated circuits, is an important foundational material in the electronics and information technology sector. During the packaging process, a specialized surface treatment must be applied to the lead frame to ensure chip mounting/bonding performance. Common coating elements on lead frames include gold, silver, palladium, nickel, and others. In recent years, according to industry requirements, the coatings on lead frames have become increasingly thinner. The high-precision X-ray fluorescence (XRF) analyzer developed by LANScientific is suitable for this highly demanding testing application, allowing simultaneous measurement of coating thickness and composition with highly repeatable results in a short period.