INSIGHT Electronic Application Scopes
The most fundamental process to ensure the reliability and stability of product quality in the electronics industry is the control of coating thickness. Coating thickness is the most important assurance factor for product quality. Therefore, quality control/assurance of coating thickness is extremely important.
X-Ray Fluorescence (XRF) has become a widely used technique for measuring coating thickness and composition because it offers non-destructive, rapid measurement capabilities and is easy to use.
INSIGHT aims to provide accurate and efficient analytical methods for coating analysis applications. Easy to use and flexibly configurable, INSIGHT is powerful in analyzing ultra-thin coatings; it delivers fast, accurate, and repeatable results. It helps effectively improve efficiency in PCB, semiconductor, and many other electronics-related industries. Additionally, it ensures compliance with specifications, preventing risks of poor performance and costs related to scrap or rework.
Gallery
Features
Connector Element Plating Tin, gold, silver, nickel, and palladium platings applied to copper alloy contacts in the electronics industry increase corrosion resistance and improve conductivity.
Wafer Production (Semiconductor), is the silicon substrate used in chip manufacturing and is coated with conductive metal by electrolysis. The uniformity and thickness of the coating layer are critical for wafer quality.
Lead frame, is the main structure of the semiconductor package and connects the internal chip and external leads. Surface treatment is required for assembly performance; common platings are gold, silver, palladium, and nickel.
Technical Parameters
| The characteristics of | Top-down measurement structure, XYZ measurement platform, MUTI-FP multilayer algorithm |
| Scope of element | Na(11)—Fm(100) |
| Analysis of the layer number of | 5 layers (4 layers + substrate) each layer can analyze 10 elements, composition analysis can analyze up to 25 elements |
| X-Ray tube | 50 W (50 kV, 1mA) micro-focused tungsten palladium ray tube (target material is optional) |
| The detector | High sensitivity large area SDD detector, SDD 50mm2 large area detector, (optional) |
| Collimator | Multiple collimators are optional, and multiple collimators can be combined |
| The camera | High resolution CMOS color camera, 5 megapixels |
| Manual sample XY platform | Moving range：100mm x 150 mm |
| Programmable XY platform | (Optional) |
| Z-axis range of movement | 150 mm |
| Sample bin size | 564mm × 540mm × 150mm (L x W x H) |
| Overall dimensions | 664mm × 761mm ×757mm (L x W x H) |
| weight | 120kg |
| The power supply | AC 220V±5V 50Hz(The configuration varies slightly by region) |
| Rated power | 150W |
Advantages
Multiple collimator
Multiple collimators can be used optionally, or multiple collimator combinations can be automatically switched by the software, allowing flexible handling of parts in different sizes.
Top-Bottom Design
The device adopts a Top-Down design that easily enables fast, accurate, stable, and efficient measurement of super large, irregular, small, and even liquid samples.
High Intensity X-Ray Tube
INSIGHT can be equipped with a high-density capillary optical system, which enables higher count rates, smaller spot measurements, and finer coating measurements, helping to double the device's analytical efficiency.
Highly sensitive detector
SDD series detectors for complex coating structures make it easier to analyze elements with XRF-like features such as better resolution and lower background noise (highest S/N ratio), and can measure thinner coatings more accurately.
Auto Focus
Samples are automatically focused within seconds, regardless of sample thickness or size. Samples can be measured from distances of up to 80 mm. The device is ideal for measuring parts with recessed surfaces or multiple samples at different heights.
Programmable automatic sample stage
The device is equipped with an automatic platform that enables easy automatic measurement, allowing samples to be prepared and measured more quickly, thereby increasing the analysis throughput.
One touch measurement
The device is equipped with easy-to-use, intuitive, and intelligent analysis software. Anyone can test samples without any training. Simply click “Start Test,” and you can obtain the test results within seconds.
Large measuring room
The slotted design of the device body (C-slot) expands the measurement area and makes sample placement easier. It can measure large and flat objects such as printed circuit boards, as well as large samples with complex shapes.
Increase productivity
INSIGHT automation helps you measure samples faster, increasing your productivity.